Protective tape for semiconductor industries

The die and other components are exposed to high temperatures or harsh environments during the production process.

Prostech provides a wide range of tape to effectively temporary protection, typical applications include:

• Carrier for Embedded die/ Sputtering & High-temp Process
• Lead frame molding
• Bump encapsulation
• Sensor protection

Feature

• High-temperature resistance
• No residue and non-fogging
• Solvent resistance