BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.
Our Solder Spheres for PBGA, CBGA, TBGA, CSP, and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s request of various sizes. BGA Sphere is available for customers’ specifications.
Diameters | 0.20mm |
Diameters Tolerances | ±5 µm |
Alloy | Sn/Ag3.0/Cu0.5 |
Appearance | Bright and shiny surface finishes |
Shape | Sphere |
Density | 7.4 g/cm³ (20℃) |
Melting Point | 217~219℃ |
Standard | According to JIS-Z-3282 |
Storage and Handling | Storage must be in a dry, non-corrosive and shine environment |