BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.
Our Solder Spheres for PBGA, CBGA, TBGA, CSP, and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, and bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s requests for various sizes. BGA Sphere is available for customers’ specifications.
| Diameters | 0.50mm |
| Diameters Tolerances | ±20 µm |
| Alloy | Sn/Ag3.0/Cu0.5 |
| Appearance | Bright and shiny surface finishes |
| Shape | Sphere |
| Density | 7.4 g/cm³ (20℃) |
| Melting Point | 217~219℃ |
| Standard | According to JIS-Z-3282 |
| Storage and Handling | Storage must be in a dry, non-corrosive and shine environment |
