BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.

Our Solder Spheres for PBGA, CBGA, TBGA, CSP, and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, and bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s requests for various sizes. BGA Sphere is available for customers’ specifications.