PF735-EP307 joint enhanced solder paste (JEP) is a low-melting-point epoxy-based solder material for extremely fine-pitch or fine-pad soldering, especially advanced display assembly. Has the advantages of conventional solder paste and anisotropic conductive paste; i.e., self-alignment and planar insulation, respectively. Epoxy is cured after reflow and provides bonding strength and joint protection. Reliability performance is enhanced as well. Adopts newly designed epoxy-based flux that performs better for printability, longer printing lifetime and more reliability than typical epoxy-based solder pastes.
Alloy | SAC305 |
Reflow temperature | < 190°C |
Flux | REL0 |
Halogen Content | No Halogen |
Particle | Type 4 – Type 7 |