SILCOOL™ TIA221GF is a two-component silicone gap filler offering thermal conductivity and mechanical stability. Dispensed as a paste, it cures at room temperature and forms a secure thermal path in electronic assemblies, providing an efficient alternative to pre-formed thermal pads.
TIA221GF Features:
Low density for lightweight applications
Good thermal conductivity
Easy 1:1 mix ratio
Fast room-temperature curing
Flame retardant (UL94 V-0 equivalent)
TIA221GF Applications:
Thermal interface for consumer electronic components
Gap filling for high-efficiency thermal transfer
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
