Soder-Wick Lead-Free SD Desoldering Braid SW14035

Soder-Wick Lead-Free SW14035 is the state of the art in desoldering technology. It is specially designed for removal of today’s high temperature lead-free solders. The single layer weave used for Soder-Wick Lead-Free braid is lighter in mass than any other desoldering braid available and allows for lead-free solder removal at lower temperatures. Soder-Wick Lead-Free responds faster than any other conventional desoldering braid. This unique design minimizes overheating and requires less “contact” time thus preventing heat damage to the PCB and sensitive components. For
Lead-Free rework, Soder-Wick has the answer.

FEATURES:

•  Fastest wicking and heat transfer
•  High capacity for solder uptake
•  Halide free, no corrosive residues
•  Minimizes risk of heat damage to pads, components and PBCs
•  Can be used with Tin/Lead solders

TYPICAL APPLICATIONS: Soder-Wick Lead-Free SW14035 desoldering braid safely removes solder from:

•  Thru-hole Components
•  SMT Pads and BGA Pads
•  Micro Circuits
•  Terminals, Lugs and Posts
•  Identification Script