Soder-Wick No Clean 60-2-5 is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.
FEATURES:
- Requires little or no post solder cleaning
- No corrosive residues
- Halide free
- ESD Safe bobbins meet specs:
MIL-STD-1686C
MIL-HDBK-263B
Static decay provision of
MIL-B-81705C - Minimal risk of heat and static component damage
TYPICAL APPLICATIONS: Soder-Wick No Clean 60-2-5 safely removes solder from:
- Lugs and Posts
- Micro Circuits
- Surface Mount Device Pads
- Ball Grid Array Pads
| Surface Insulation Resistance |
| Bellcore TR-NWT-000078: PASS After 96 Hours (megohms) 2 x 104 Limit Group A Group B Group C 4.8 x 10∧6 3.8 x 10∧6 4.1 x 10∧6 |
| ANSI/IPC J SF-818 : PASS After 168 Hours (ohms) 1.8 x 108 Limit 1-2 2-3 3-4 4-5 2.3 x 10∧10 2.6 x 10∧10 2.8 x 10∧10 2.8 x 10∧10 |
| Electromigration : PASS Average Insulation Resistance (megohms)-One Decade Limit Initial Final Group E 3.93 x 10∧3 1.24 x 10∧4 Group F 3.87 x 10∧3 2.84 x 10∧4 At 10x magnification no evidence of electromigration or heavy corrosion. |
| Silver Chromate Test Paper: PASS |
| Copper Mirror Test: PASS |
| Shelflife: 2 years |