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Home > Products > By Manufacturer > Chemtronics > Soder-Wick No Clean Desoldering Braid 60-3-10

Soder-Wick No Clean Desoldering Braid 60-3-10

  • Product code: 60-3-10
  • Manufacturer: Chemtronics
  • Package size: #3 green, 0.080"/2.0mm width 10' / 3.0 m length on SD bobbin
  • Shelf Life: 2 years

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  • Product Details
  • Typical Properties
  • TDS/MSDS
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Soder-Wick No Clean 60-3-10 is designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick No Clean uses pure, oxygen free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity.

FEATURES:

  •  Requires little or no post solder cleaning
  •  No corrosive residues
  •  Halide free
  •  ESD Safe bobbins meet specs:
                     MIL-STD-1686C
                     MIL-HDBK-263B
                     Static decay provision of
                     MIL-B-81705C
  •  Minimal risk of heat and static component damage

TYPICAL APPLICATIONS: Soder-Wick No Clean 60-3-10 safely removes solder from:

  •  Lugs and Posts
  •  Micro Circuits
  •  Surface Mount Device Pads
  •  Ball Grid Array Pads
Surface Insulation Resistance
Bellcore TR-NWT-000078:                                                   PASS
     After 96 Hours (megohms) 2 x 104 Limit
Group A                                      Group B                                      Group C
4.8 x 10∧6                                  3.8 x 10∧6                                  4.1 x 10∧6
ANSI/IPC J SF-818 :                                                               PASS
     After 168 Hours (ohms) 1.8 x 108 Limit
      1-2                                2-3                              3-4                                  4-5
2.3 x 10∧10               2.6 x 10∧10                2.8 x 10∧10                   2.8 x 10∧10
Electromigration :                                                                  PASS
     Average Insulation Resistance
     (megohms)-One Decade Limit
                                                                      Initial                            Final
          Group E                                        3.93 x 10∧3                  1.24 x 10∧4
          Group F                                        3.87 x 10∧3                  2.84 x 10∧4
  At 10x magnification no evidence of electromigration or heavy corrosion.
Silver Chromate Test Paper:                                              PASS
Copper Mirror Test:                                                              PASS
Shelflife:                                                                                    2 years

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