FEATURES:
- The G-Series Solder Pastes are composed of ultra fine spherical solder power with a very low oxide content and a highly reliable flux.
- Low flux residue, non halide, low flux activity, high reliability.
- New Halogen-free lead free solder paste.
- Improvement on long tackiness time and stable viscosity with new flux technology.
Flux Clasification | NC (No Clean) |
Alloy Composition | Sn96.5Ag3Cu0.5 |
Power Size | 20-45 μm |
Flux (%) | 11.5±0.5 |
Flux Series | 3 |