Electronic components need to be protected against moisture, dust dirt, vibration, and even temperature. Low Pressure Molding is an advanced method to take charge of this function with a gentle but reliable encapsulation around the electronic assemblies, especially the delicate ones.
Simple Process
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Step 01
Input the workpiece into the mold set.
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Step 02
Low-Pressure Molding System automatically molds the workpiece.
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Step 03
Take out the end-product as the mold is cold-down in seconds afterward.
Excellent Finished Product
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Waterproof
Impact and Vibration
Protection against the Environment
Chemical Resistant
Strain Relief
“Green” technology, No VOC & Low Waste
Cost Effective
Weight Reduction
Detailed Application
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Useful Information
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