What is potting and encapsulation? How different are they?
Potting is protection solution, by which a “pot” in different forms like a housing, a case, etc with the electronics parts is filled with a polymer resin and becomes an intergral part of the finished component.
While Encapsulation differs in that the parts and the hardened resin around them are removed from the “pot” placed in an assembly.
Which method is chosen depends on various factors, such as the design of the component, the manufacturing and assembly process, and the demands of the application such as:
