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What is potting and encapsulation? How different are they?
Potting is protection solution, by which a “pot” in different forms like a housing, a case, etc with the electronics parts is filled with a polymer resin and becomes an intergral part of the finished component.
While Encapsulation differs in that the parts and the hardened resin around them are removed from the “pot” placed in an assembly.
Which method is chosen depends on various factors, such as the design of the component, the manufacturing and assembly process, and the demands of the application such as:
Electrical Insulation
Enhanced Mechanical Strength
Heat Dissipation
Chemical protection
Corrosion protection
Shock/ Vibration Resistance
Why it matters
Over other popular electronic and electrical protection methods
The main reasons for using potting and encapsulation compounds over other types of protection such as Coating, Low pressure molding (LPM), Sealants:
Excellent protection level
While traditional coatings are not waterproof or resistant to corrosive gases, and Low-Pressure Molding (LPM) lacks stability in high-temperature environments while being sensitive to chemical exposure, potting and encapsulation solutions offer superior durability with exceptional thermal conductivity, high operating temperature resistance, and protection against almost all hash conditions—making them ideal for automotive, aerospace, and marine applications where performance is pushed to the limits
Cost effieciency
In applications where high temperatures are not a concern, engineers often weigh the choice between LPM and potting. Potting is a cost-effective alternative, offering a better level of protection at a significantly lower material cost—typically ranging from 50% to 75% of LPM’s cost, making it a smart choice for budget-conscious projects
Vision systems, electronic control modules, safety and security systems, sensors, lightning and EV battery modules are the areas where potting and encapsulation is used to protect under-the-hood components against risk damage from high temperatures and Elsewhere on the vehicle, contaminants from harsh external environments within the vehicle lifespan
All consumers with exposure of destructive factors such as dishwashers, washing machine, refridges, oral brushers, etc all needs potting or encapsulation to ensure function without fail
Industrial electronics have to be rugged such as transformers, water meter sensors, industrial lighting and stadium lighting, etc. They are likely to need potting or encapsulation to withstand all types of weather conditions, extreme temperature swings and constant operation
We divide potting compound into 3 main chemical types: Silicone, Epoxy and PU
Performance Comparison of Silicones, Urethanes and Epoxys in Flexibility and Mechanical Strength
Comparision of Temperature Resistance of Silicone, Urethane and Epoxy
By constituent
The ‘K’ stands for component, and the number (1 or 2) stands for the number of components there are
1K Potting
1K systems have pre-mixed hardeners, eliminating the need for metering and mixing. However, they require cold storage and transport, increasing costs, risk of material failure, and reducing shelf life at least half compared to 2K potting/ encapsulation
Equipment
Nowadays, no one can deny the importance of automation in manufacturing industries, especially the high-productivity industry as electronics. To help manufacturers get rid of tedious, time-consuming, and health-hazardous manual processes, PROSTECH provides our customers with a professional Electronics Potting System with various customizable options and services.
Single-part Adhesive Potting System
Two-part Compound Potting System
Vacuum Potting System
As an automated dispensing system is a medium to large investment, it is essential to consider carefully multiple elements to come to the final decision. PROSTECH is here to help. Contact us if you have any requirements regarding this application.
