SpeedMask 9-20474-B-REV-A is a blue masking material that cures upon exposure to UV/Visible light and is designed for rapid masking of electronic components and assemblies. The mask is easily removable, eliminating the concern of ionic contamination or silicone left behind by other masking methods. Dymax SpeedMask materials contain no nonreactive solvents. This peelable mask is designed for rapid masking of electronic components and assemblies to protect from reflow or wave soldering operations, and shield keep-out areas during conformal coating applications. 9-20479-B-REV-A is exceptionally thixotropic for manual or automated dispensing on boards or components that may be difficult to mask with other methods.
FEATURES:
- UV/Visible Light Cure
- Compatible with Gold and Copper Pins
- Exceptionally Thixotrophic for Manual of Automated Dispensing
- Solvent Free
- Blue Color for easy visual inspection
- Halogen free
- Silicone free
APPLICATIONS:
- Masking for conformal coating application
- Masking for wave solder or reflow processes
| Uncured properties | ||
| Property | Value | Test Method |
| Solvent content | No nonreactive solvents | N/A |
| Chemical class | Acrylated urethane | N/A |
| Appearance | Blue translucent gel | N/A |
| Soluble in | Organic solvents | N/A |
| Density, g/ml | 1.13 g/ml | ASTM D1875 |
| Viscosity, cP (20 rpm) | 115000 | DSTM502 |
| Cured mechanical properties | ||
| Property | Value | Test Method |
| Durometer hardness | A75 | ASTM D2240 |
| Tensile at break, MP a [psi] | 3.37 [490] | ASTM D638 |
| Elongation at breat, % | 140 | ASTM D638 |
| Modulus of Elasticity, MPa [psi] | 4.13 [600] | ASTM D638 |
| Other cured properties | ||
| Property | Value | Test method |
| Boiling water absorption, % (2 hr) | 6 | ASTM D570 |
| Water Absorption, % (25° C, 24 hr) | 6 | ASTM D570 |
| Linear Shrinkage, % | 1.6 | ASTM D2566 |