SpeedMask 9-7001 cures upon exposure to light and is designed to provide protection of connectors and board surfaces during solvent-based or light-curable conformal coating applications in printed wiring board (PWB) assembly. The maskant is easily removable, eliminating the concern of ionic contamination or silicone left behind by other masking methods. SpeedMask materials contain no nonreactive solvents.
FEATURES:
- Compatible with gold and copper connector pins
- One layer protection
- UV/Visible light curing
- Visible pink color in uncured state
- Non-slumping when dispensed
- Halogen free – pending
- Resistance to solvent based conformal coatings and primers
- Thixotropic for manual or automated dispensing
- Fast curing
- Tack free with depth of cure up to 0.5″
- Lower shrinkage
- Silicone free
APPLICATIONS:
- Masking for solvent based conformal coating applications
- Masking for wave solder of reflow processes
| Uncured properties | ||
| Property | Value | Test Method |
| Solvent content | No nonreactive solvents | N/A |
| Chemical class | Acrylated urethane | N/A |
| Appearance | Pink translucent gel | N/A |
| Soluble in | Organic solvents | N/A |
| Density, g/ml | 1.14 g/ml | ASTM D1875 |
| Viscosity, cP (20 rpm) | 40000 (nominal) | DSTM D502 |
| Cured mechanical properties | ||
| Property | Value | Test Method |
| Durometer hardness | A70 | ASTM D2240 |
| Tensile at break, MP a [psi] | 3.8 [560] | ASTM D638 |
| Elongation at breat, % | 180 | ASTM D638 |
| Modulus of Elasticity, MPa [psi] | 1.9 [275] | ASTM D638 |
| Other cured properties | ||
| Property | Value | Test method |
| Boiling water absorption, % (2 hr) | 9.8 | ASTM D570 |
| Water Absorption, % (25° C, 24 hr) | 16.6 | ASTM D570 |
| Linear Shrinkage, % | 1.9 | DSTM 614 |
| Glass Transition Tg, °C | 29 | DSTM 256 |