Prostech Philippines

SpeedMask 9-7001 cures upon exposure to light and is designed to provide protection of connectors and board surfaces during solvent-based or light-curable conformal coating applications in printed wiring board (PWB) assembly. The maskant is easily removable, eliminating the concern of ionic contamination or silicone left behind by other masking methods. SpeedMask materials contain no nonreactive solvents.

FEATURES:

Compatible with gold and copper connector pins
One layer protection
UV/Visible light curing
Visible pink color in uncured state
Non-slumping when dispensed
Halogen free – pending
Resistance to solvent based conformal coatings and primers
Thixotropic for manual or automated dispensing
Fast curing
Tack free with depth of cure up to 0.5″
Lower shrinkage
Silicone free

APPLICATIONS:

Masking for solvent based conformal coating applications
Masking for wave solder of reflow processes

Uncured properties
Property	Value	Test Method
Solvent content	No nonreactive solvents	N/A
Chemical class	Acrylated urethane	N/A
Appearance	Pink translucent gel	N/A
Soluble in	Organic solvents	N/A
Density, g/ml	1.14 g/ml	ASTM D1875
Viscosity, cP (20 rpm)	40000 (nominal)	DSTM D502

Cured mechanical properties
Property	Value	Test Method
Durometer hardness	A70	ASTM D2240
Tensile at break, MP a [psi]	3.8 [560]	ASTM D638
Elongation at breat, %	180	ASTM D638
Modulus of Elasticity, MPa [psi]	1.9 [275]	ASTM D638

Other cured properties
Property	Value	Test method
Boiling water absorption, % (2 hr)	9.8	ASTM D570
Water Absorption, % (25° C, 24 hr)	16.6	ASTM D570
Linear Shrinkage, %	1.9	DSTM 614
Glass Transition Tg, °C	29	DSTM 256

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SpeedMask 9-7001

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