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Home > Products > By Application > Thermal Management > t-Global Ultra Soft Thermal Pad PT-TG-3500F

t-Global Ultra Soft Thermal Pad PT-TG-3500F

  • Product code: t-Global PT-TG-3500F
  • Manufacturer: t-Global
  • Package size: Sheet Ones
  • Shelf Life:

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  • Description
  • Specification
  • TDS/MSDS
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By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

FEATURES:

  • Very good thermal conductivity
  • Fiberglass on one side
  • Non deforming
  • Electeical insulation

APPLICATION:

  • Best for high power applications
  • Electronic components: IC, CPU, MOS, LED, Mother Board, Power Supply, Heat Sink, LCD-TV, Notebook, PC, Telecom Device, Wireless
  • Hub, DDR ll Module, DVD Applications, Handset applications, etc.
Properties TG-A3500F Unit Tolerance Test Method
Thermal Conductivity

3

W / mK

±10%

ASTM D5470

Thickness

0.5~ 8.0

mm

–

ASTM D374

0.0197~ 0.315

inch

–

ASTM D374

Color

yellow

–

–

Visual

Reinforcement Carrier Fiberglass – – –
Flame Rating 

V-0

–

–

UL 94

Dielectric Breakdown Voltage

>6

KV / mm

–

ASTM D149

Weight Loss 

<1

%

–

ASTM E595

Density 

2.3

g / cm3

–

ASTM D792

Working Temperature  -50 ~ +150 °C – –
Volume Resistance  8×1012 Ohm-m – ASTM D257
Elongation 

80

%

–

ASTM D412

Standard Shape 

Sheet ones

–

–

–

Hardness(Silicone side)

30

Shore 00

±15

ASTM D2240

TDS:Download

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    • t-global thermal pad

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