T69-70 is a high performing thermal interface material which is very thin, synthetically made from a highly oriented graphite polymer film and has excellent thermal properties in all axes. T69-70 is ideal for providing thermal management in some of the most demanding of applications.
FEATURES
- Highly oriented pyrolytic graphite sheet with high thermal conductivity
- It is flexible and has features of ultra-thin and high EMI shielding effect
- Excellent thermal conductivity: 1600 W/ mK (4 times as high as copper, 7 times as high as aluminium)
- Light weight: Specific gravity: 2.3
- Flexible and easy to be cut or trimmed
- Low thermal resistance
- Low moisture content: < 1%
APPLICATIONS
- Electronic components: IC, CPU, MOS
- LED, M/B, P/S, Heat Sink
- LCD, TV, Notebook PC, PC Telecom Device, Wireless, etc.
- DDR II Module, DVD Applications, Hand-set applications, etc.
Property | T69-70 | Unit | Tolerance | Test Method | |
Thickness | 70um | mm | – | Micrometer | |
0.070 | mm | ±0.017 | Micrometer | ||
Thermal Conductivity |
X-Y Direction | 1000 | W/mK | – | AC calorimeter |
Z Direction | 20 | W/mK | – | Laser flash | |
Thermal diffusivity | 8 – 10 (0.0008- .0010m²/s |
cm²/s | – | AC calorimeter |
|
Density | 1.2 (1200 kg/ m³) |
g/cm³ | – | Archimedes law |
|
Specific heat (at 50ºC) | 0.85 (850J/kgk) |
(J/gk) | – | – | |
Heat resistance | 400 | ºC | – | – | |
Extensional strength |
X-Y Direction | 20 | Mpa | – | – |
Z Direction | 0.4 | Mpa | – | – | |
Expansion coefficient |
X-Y Direction | 9.3 x 10-7 | 1/K | – | – |
Z Direction | 3.2 x 10-5 | 1/K | – | – | |
Bending test (R5/180ºC) | 20000 or more |
Times | – | – | |
Electric conductivity | 2000 | S/cm | – | JISK7194 | |
Operating Temperature | -50 to 200 | ºC | – | – | |
Shelf Life | 36 | months | – | – |