The die and other components are exposed to high temperatures or harsh environments during the production process. Prostech provides a
Challenge The risks to chip integrity during transportation are significant due to the complex architecture. During the pick-up process, many
Challenges Solutions Liquid encapsulants Encapsulants are the last piece of the IC package and serve to protect the conductor and
What do we mean by good electrical stability? Good electrical stability means that there is a very little ionic movement
Manufacturing and reliability challenges There are multiple challenges when it comes to wire bond manufacturing and reliability. These challenges tend
Why Die bonding? Protecting the die from external factors; Redistributing the input and output to a manageable fine pitch; Offering
What is die preparation? Die preparation is the procedure used to separate the wafer into individual dice to prepare it
Why Wafer Back Grinding? Before assembly, the backside of the wafer is ground to the proper wafer thickness in a
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