Underfill
Everwide JD 642-6 Epoxy for BGA – CSP Underfill
- Product code: Everwide JD642-6
- Manufacturer: Everwide
- Package size: 5ml/ 10ml/ 30ml/ 300ml/ 1L
- Shelf life: 6 months
Everwide NC 884-8 One Component Acrylic Adhesive for Die Bonding
- Product code: Everwide NC 884-8
- Manufacturer: Everwide
- Package size: 5ml/ 10ml/ 30ml/ 300ml/ 1L
- Shelf life: 8 months
PERMABOND® ES560
- Product code: ES560
- Manufacturer: Permabond
- Package size: 50 ML
- Shelf life:
Ultra Light-Weld 9309-SC – Light Cure BGA
- Product code: 9309-SC
- Manufacturer: Dymax
- Package size: 30 ml syringe
- Shelf life: 7 months
Underfills for reinforcing Components on PCBs
What is Underfill? Component underfill is a process in which a type of liquid material connects the chip to the
Materials for Underfill and Encapsulation for PCB assembly
Underfill Underfills can be used to help reinforce electronic components and minimize stress. They also offer excellent protection of solder
Underfill Application in Camera Module Assembly
The camera module industry has come into focus as smartphone, tablet & vision systems in automotive manufacturers continue to develop