Underfill

Everwide JD 642-6 Epoxy for BGA – CSP Underfill

  • Product code: Everwide JD642-6
  • Manufacturer: Everwide
  • Package size: 5ml/ 10ml/ 30ml/ 300ml/ 1L
  • Shelf life: 6 months
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Everwide NC 884-8 One Component Acrylic Adhesive for Die Bonding

  • Product code: Everwide NC 884-8
  • Manufacturer: Everwide
  • Package size: 5ml/ 10ml/ 30ml/ 300ml/ 1L
  • Shelf life: 8 months
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PERMABOND® ES560

  • Product code: ES560
  • Manufacturer: Permabond
  • Package size: 50 ML
  • Shelf life:
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Ultra Light-Weld 9309-SC – Light Cure BGA

   

  • Product code: 9309-SC
  • Manufacturer: Dymax
  • Package size: 30 ml syringe
  • Shelf life: 7 months
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Underfills for reinforcing Components on PCBs

What is Underfill?  Component underfill is a process in which a type of liquid material connects the chip to the

Materials for Underfill and Encapsulation for PCB assembly

Underfill Underfills can be used to help reinforce electronic components and minimize stress. They also offer excellent protection of solder

Underfill Application in Camera Module Assembly

The camera module industry has come into focus as smartphone, tablet & vision systems in automotive manufacturers continue to develop