Wafer Grinding

3M™ UV-Curable Adhesive LC-5200

  • Product code: LC-5200
  • Manufacturer: 3M
  • Package size: 3.7L
  • Shelf life: 6 months
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3M™ UV-Curable Adhesive LC-4200

  • Product code: LC-4200
  • Manufacturer: 3M
  • Package size: 3.7L
  • Shelf life: 6 months
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3M™ Wafer De-Taping Tape 879

  • Product code: 879
  • Manufacturer: 3M
  • Package size: Contact for more information
  • Shelf life: Contact for more information
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3M™ Light-To-Heat-Conversion Release Coating

  • Product code: LTHC Ink
  • Manufacturer: 3M
  • Package size: 20L Stainless steel drum
  • Shelf life: 12 months
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3M™ UV-Curable Adhesive LC-3200

  • Product code: LC-3200
  • Manufacturer: 3M
  • Package size: 3.7L
  • Shelf life: 12 months
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3M™ Wafer De-Taping Tape 3305

  • Product code: 3305
  • Manufacturer: 3M
  • Package size:
  • Shelf life:
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Wafer back grind supporting adhesive & tape

Why Wafer Back Grinding? Before assembly, the backside of the wafer is ground to the proper wafer thickness in a