TG997 is a soft, silicone thermal pad, suitable for use as thermal interface material or heat sink to dissipate the heat from electronic devices, especially in integrated circuit (IC) and LED packaging. TG997 offers low thermal impedance, good surface compliance and a high dielectric breakdown voltage. This thermal pad has very low hardness and elasticity, and yet provides high thermal conductivity, good high temperature resistance and good electrical insulation. TG997 can be supplied in a wide range of formats ranging from custom die cut parts to standard sheets in a range of thicknesses depending on the end application.
FEATURES
Very good thermal conductivity
Very soft and high compressibility
Natural tack
Easy to assemble
Very good insulator
APPLICATIONS
Heat dissipation from electronic components.
Property
TG 997
Unit
Tolerance
Test Method
Appearance
Blue
–
–
–
Operating temperature -40 to 200
-40 to 200
°C
–
ASTM D412
Thermal Conductivity
2.4
W/mK
–
ASTM D5470
Density
1.8
g/cm³
–
ASTM D792
Hardness
10
Shore A
–
ASTM D4120
Shelf Life
36
months
–
–
Shelf Life with adhesive
(can be requalified for further 12)
