T-Global’s range of ceramic heat sinks have been designed from a proprietary blend of engineering ceramics to offer superior thermal management for the most demanding of applications. Compared to aluminium, ceramics confer additional benefits such as electrically isolating, resistant to corrosion, low weight and does not act like an antenna. The addition of a pre-applied thermal tape further reduces the manufacturing complexity when compared to aluminium heat sinks.
FEATURES
- Large contact area
- Low weight
- High breakdown voltage
- Excellent heat spreader
- Custom shapes possible
APPLICATIONS
- LED, M/B, P/S, LCD, TV, Notebook, PC, PC Telecom Device, Wireless Hub,
Power transistor, Power module, CPU, Chip IC
Main Component | Technical Ceramic | ||
Property Type | Property | Unit | |
Physical Property | Density | g/cm3 | 3.66 |
Water Absorption | % | 0.002 | |
Sinter Temperature | °C | 1700 | |
Acid Resistance | mg/cm3 | ≦0.2 | |
Alkali | mg/cm3 | ≦0.2 | |
Mechanical Property |
Mohs Hardness | HV | 9 |
Bend Strength | Mpa | ≧ 610 | |
Compression Intensity | Mpa | ≧ 620 | |
Thermal Property | Maximum Working Temperature | °C | 1400 |
Thermal Expansion Coefficient | (1×10-6 ) mm/°C | 7.8-8.3 | |
Thermal Shock Resistance | T (°C) | 200 | |
Thermal Conductivity | W/m.k. | 40-51 | |
Electrical Property |
Resisting Rate of Volume | Ω °C | 1016 |
DC Breakdown Strength | KV/mm | 15.2-16.7 | |
Insulation Breakdown Intensity | KV/mm | 18 | |
Dielectric Constant (1MHz) | (E) | 10 | |
Dielectric Dissipation | (tg o) | 0.4*10-3 | |
Shelf Life of Tape | (can be requalified for further 12) | months | 12 |