TG-X is high performance silicone gap filler with a thermal conductivity of 12 W/mk. TG-X is highly conformable and can be supplied in either standard sheets or custom die-cut parts. TG-X is formulated to wet most surfaces and provide low thermal impedance for the most demanding of applications.
FEATURES
High-end product with thermal conductivity of 12 W/mK
Highly compressible
Naturally tacky
Low Shore 00 hardness
Low oil bleed
Electrically insulating
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless Hub, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
Property
TG-X
Unit
Tolerance
Test Method
Colour
Grey
–
–
Visual
Thickness (Available thickness
range)
0.5 – 2.0
mm
–
ASTM D374
0.0197 – 0.0787
inch
–
ASTM D374
Thermal Conductivity
12
W/mK
±1.2
ASTM D5470
Flammability Rating
V-0
–
–
UL 94
Dielectric Breakdown Voltage
12
kV/mm
±1.2
ASTM D149
Weight Loss
‹1
%
–
ASTM E595
Density
3.4
g/cm³
±0.2
ASTM D792
Working Temperature
-45 to 200
˚C
–
–
Volume Resistance
›10¹¹
Ohm-cm
–
ASTM D257
Standard Shape
320-320mm
Sheets
–
–
Hardness
65
Shore 00
±15
ASTM D2240
Shelf Life
36
months
–
–
Shelf Life with adhesive
(can be requalified for further 12)
