TGKXTW is a one-part, high performance thermal conductive adhesive based on epoxy resins. It cures rapidly at elevated temperatures and has excellent adhesion to most PC boards and electronic components. It may be cured at 100°C or faster at 150°C. and show no sagging. It has a stable pot life and long shelf life even at room temperature of 25°C. It has relatively low viscosity for quicker dispensing from syringes.
FEATURES
- Single component epoxy
- 6 month shelf life at -20°C
- Low viscosity for quicker dispensing from syringes
APPLICATIONS
- Heat dissipation from electronic components
| Property | TGKXTW | Unit | Test Method |
| Appearance | White paste | – | Visual |
| Mix ratio, w/w | One component | – | – |
| Shelf life, -20°C | 6 | Month | In House Test Method |
| Pot life, 25°C | 1 | Week | In House Test Method |
| Viscosity, Brookfield RVT, 25°C | 110,000 | cP | ASTM D1084-88 |
| Hardness, cured 120°C/1 hr | 86-96 | Shore D | ASTM D2240-97 |
| Shear strength, cured 120°C/1 hr | 182 | Kg/cm | In House Test Method |
| Thixotropic Index | 1.8-2.8 | – | ASTM D2196-15 |
| Specific gravity, 25°C | 1.98 | – | ASTM D891-95 |
| Tensile Strength | 9,000 -12,500 | psi | – |
| Elongation at break | 0.5-3.0 | % | – |
| TG, DSC, cured 120°C/1 hr | 120-135 | °C | ASTM D3418-03/E1356-03 |
| CTE -1 -2 |
4.0-8.0×10-6 1.4-2.5×10-5 |
m/m/°C | – |
| Boiling water wt gain, cured 120°C/1 hr |
<1.0 | % | In House Test Method |
| Ionic content, Cl | <50 | ppm | – |
| Ionic content, K | <50 | ppm | – |
| Ionic content, Na | <180 | ppm | – |
| Thermal conductivity | >1.1 | W/mK | ISO/DIS22007 |
| Electrical resistivity | >1.1 | Ωcm | – |
| Filler type Metal oxide | Metal oxide | – | – |