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TGKXTW Thermal Conductive Epoxy

  • Product code: TGKXTW
  • Manufacturer: t-Global
  • Package size: 30ml/300ml/1kg
  • Shelf Life: 6 months

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TGKXTW is a one-part, high performance thermal conductive adhesive based on epoxy resins. It cures rapidly at elevated temperatures and has excellent adhesion to most PC boards and electronic components. It may be cured at 100°C or faster at 150°C. and show no sagging. It has a stable pot life and long shelf life even at room temperature of 25°C. It has relatively low viscosity for quicker dispensing from syringes.

FEATURES

  • Single component epoxy
  • 6 month shelf life at -20°C
  • Low viscosity for quicker dispensing from syringes

APPLICATIONS

  • Heat dissipation from electronic components
Property  TGKXTW Unit Test Method
Appearance White paste – Visual
Mix ratio, w/w  One component – –
Shelf life, -20°C  6 Month In House Test Method
Pot life, 25°C  1 Week In House Test Method  
Viscosity, Brookfield RVT, 25°C  110,000 cP ASTM D1084-88
Hardness, cured 120°C/1 hr  86-96 Shore D ASTM D2240-97
Shear strength, cured 120°C/1 hr  182 Kg/cm In House Test Method
Thixotropic Index  1.8-2.8 – ASTM D2196-15
Specific gravity, 25°C  1.98 – ASTM D891-95
Tensile Strength 9,000 -12,500  psi –
Elongation at break 0.5-3.0 % –
TG, DSC, cured 120°C/1 hr  120-135 °C  ASTM D3418-03/E1356-03
CTE
-1
-2		 4.0-8.0×10-6
1.4-2.5×10-5		 m/m/°C –
Boiling water wt gain, cured
120°C/1 hr		 <1.0 % In House Test Method
Ionic content, Cl  <50 ppm –
Ionic content, K  <50 ppm –
Ionic content, Na  <180 ppm –
Thermal conductivity >1.1 W/mK ISO/DIS22007
Electrical resistivity  >1.1 Ωcm –
Filler type Metal oxide Metal oxide – –

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