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TGNSP36K-1 Non-Silicone Putty

  • Product code: TGNSP36K-1
  • Manufacturer: t-Global
  • Package size: 30ml/55ml/500g/9kg
  • Shelf Life: 12 months

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TG-NSP36K-1 is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic devices. This material is designed to optimize flow from a dispensing system and also provides a low thermal impedance for enhanced cooling.

FEATURES

  • Excellent thermal conductivity 4.4W/mK
  • Fully cured and reworkable
  • Ideal for wide range of gaps
  • Fully supported optimisation of dispense systems

APPLICATIONS

  • Consumer electronics
  • Power supplies and semi-conductors
  • Automotive
  • LED lighting
Property TG-NSP36K-1 Unit Tolerance Test Method
Colour  Light Blue – – Visual
Mix ratio, by weight  One component – – –
Extrusion rate, 2.5mm orifice,
50psi, 25˚C 		 8.5 g/min – –
Temperature Range  -40 to 200 ˚C – –
Flow Test, 45˚ incline  Non flow mm – –
Specific Gravity 25˚C  3.0 – – ASTM D792
Thermal Conductivity  4.4 W/mK – ASTM D5470 
Volatile Content <0.6 % – ASTM E595
Oil Bleeding 100˚C/100h 45 mm – –
Shelf Life 12 months – –

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