Home > New Products > TGNSP36K Non-Silicone Putty

TGNSP36K Non-Silicone Putty

  • Product code: TGNSP36K
  • Manufacturer: t-Global
  • Package size: 30ml/55ml/500g/9kg
  • Shelf Life: 12 months

Request Quote Request Sample

TG-NSP36K is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic devices. This material is designed to optimize flow from a dispensing system and also provides a low thermal impedance for enhanced cooling.

FEATURES

  • Excellent thermal conductivity 4.5W/mK
  • Fully cured and reworkable
  • Ideal for wide range of gaps
  • Fully supported optimisation of dispense systems

APPLICATIONS

  • Consumer electronics
  • Power supplies and semi-conductors
  • Automotive
  • LED lighting

Typical Properties

Property TG-NSP36K Unit Tolerance Test Method
Colour Light grey – – Visual
MIx ratio, by weight One component – – –
Extrusion rate, 2.5mm orifice,
50psi, 25˚C 		 2.0 g/min – –
Temperature Range  -40 to 200 ˚C – –
Flow Test, 45˚ incline  Non flow mm – –
Specific Gravity 25˚C  3.1 – – ASTM D792
Thermal Conductivity  4.5 W/mK – ASTM D5470
Volatile Content <0.5 % – ASTM E595
Oil Bleeding 100˚C/100h  50 mm – –
Shelf Life 12 months – –

Resources

TDS:Download

Related Article

Similar Products

Outstanding Feature Product Group

Contact Us

    Leave your information via Form, our Technical Support Team will contact you shortly!