SilCool TIA208R is a 2-component, thermally conductive material used for potting and gap filling. When cured at room temperature or quickly with heat, it cures to a thermally conductive rubber that adheres well to most metal and plastic substrates without the need for primers. The flowability of SilCool TIA208R allows it to conform to complex 3-dimenstional shapes and cavities, filling voids and thereby creating a thermal path to remove heat.
Key features
- Primerless adhesion to metals and plastics
- Good thermal conductivity
- Ease of use 1:1 mixing ratio
- Quick cure and adhesion with heat or at room temperature
- Flame retardancy: UL94V-0 certified (File No: E56745)
- Continuous operating temperature range of -40 ~ 150°C
- UL RTI rating: 150°C
Applications
- Thermal potting for power supplies
- Drivers in LED light bulbs
- Ballasts and electronic devices
Property | Value |
Appearance | Black (A); Light Gray (B) |
Viscosity | 4.0 (A); 3.8 (B) |
Mixing ratio by weight | 1 : 1 |
Viscosity (mixed) | 4.2 |
Workable Life | 90 |
Flowable Life | 30 |
Cure Condition (Heat Cure) | 70°C x 30min |
Cure Condition (Room Temperature Cure) | 23°C x 24H |