TIA200R is a one component, heat curable silicone adhesive designed for thermally conductive applications. TIA200R cures quickly upon exposure to heat, and adheres well to a wide variety of substrates.
Key Features
- Good thermal conductivity
- Fast cure with heating
- Easy to use
- Electrically insulated
- Primeless adhesion to many substrates
- No corrosive to metal
Applications
- Thermal Interface Material between dies and heat spreaders
- Adhesive for use between various heat sources and heat dissipation devices
UNCURED PROPERTIES (23 °C, 50%RH) | Value |
Appearance | Gray |
Viscosity Pa·s | 70.0 |
Cure condition (120 °C) min | 30 |
CURED PROPERTIES (30 min @ 120 °C) | Value |
Appearance | Gray rubber |
Density g/cm3 | 2.88 |
Hardness (Shore A) | 85 |
Lap Shear Strength MPa | 3.0 |
Cohesive Failure % | 100 |
Thermal conductivity W/(m·K) | 2.0 |
Dielectric Strength kV/mm | 20 |
Volume Resistivity MΩ·m | 4.8×10^6 |