TIA200R-G is a one component, heat curable silicone adhesive designed for thermally conductive application. TIA200R-G cures quickly upon exposure to heat, and adheres well to a wide variety of substrates.
Key Features
- Good thermal conductivity
- Fast cure with heating
- Easy to use
- Electrically insulated
- Primeless adhesion to many substrates
- No corrosive to metal
| UNCURED PROPERTIES (23 °C, 50%RH) | Value |
| Appearance | Gray |
| Viscosity Pa·s | 70.0 |
| Cure condition (120 °C) min | 30 |
| Thixotrophy | 3.5 |
| CURED PROPERTIES (30 min @ 120 °C) | Value |
| Appearance | Gray rubber |
| Density g/cm3 | 2.88 |
| Hardness (Shore A) | 85 |
| Lap Shear Strength MPa | 3.0 |
| Thermal conductivity W/(m·K) | 2.0 |
| Dielectric Strength kV/mm | 20 |
| Volume Resistivity MΩ·m | 4.8×10^6 |
