THERMELT PAR 1000 black is a pure croslinkable copolymer polyamide hot melt resin, reactive and solvent free, specially designed for Low Pressure Molding applications.
FEATURES:
- Cross-linkable material providing unparalleled temperature resistance
- Easy flow ability thanks to low viscosity
- Very good adhesion and cohesion for high temperature needs
APPLICATIONS:
THERMELT PAR 1000 is mainly used for molding of electronic/elecgtric components, connectors and cables
PHYSICAL PROPERTIES | VALUE | STANDARD TEST |
Viscosity Brookfield | 1.0 – 3.0 Pa.s | ASTM D3236 |
Softening point | 155 – 170 °C | ASTM D3461 |
Commercial shape | Solid block | |
Packaging | 2.5 kg aluminum foiled bags 14 kg drum |