Ti900 is a high thermal performance insulator pad designed to maximize thermal conductivity and electrical isolation performance for a wide variety of applications. The unique formulation offers a smooth and compliant surface which minimizes interfacial thermal resistance at low mounting forces.
FEATURES
High insulation strength
Low thermal resistance
Die cut for custom shapes
Easy to assemble
APPLICATIONS
Electronic components: IC, CPU, MOS
LED, M/B, P/S, Heat Sink
LCD, TV, Notebook PC, PC Telecom Device, Wireless, etc.
DDR II Module, DVD Applications, Hand-set applications, etc.
Typical Properties
Property
Ti900
Unit
Test Method
Viscose
One Side
–
ASTM D374
Thickness
0.12
mm
–
Base
RITF
–
–
Thermal Conductivity
1.8
W/mK
ASTM D5470
Thermal Resistance @ 10psi
0.50
K in²/W
ASTM D5470
Thermal Resistance @ 30psi
0.42
K in²/W
ASTM D5470
Thermal Resistance @ 50psi
0.35
K in²/W
ASTM D5470
Thermal Resistance @ 100psi
0.29
K in²/W
ASTM D5470
Thermal Resistance @ 200psi
0.28
K in²/W
ASTM D5470
Thermal Resistance @ 400psi
0.27
K in²/W
ASTM D5470
Insulation Strength Vac, V
›6000
–
ASTM D149
Volume Resistance
›10¹²
Ohm-cm
ASTM D257
Working Temperature
-50 to 180
oc
–
Tensile Strength
5000
psi
ASTM D412
Elongation
40
%
ASTM D412
Flammability Rating
V-0
–
UL94
Shelf Life
36
months
–
Shelf Life with adhesive
(can be requalified for further 12)
