TSE3251 is a semi-flowable silicone adhesive that is heat curable and consists of only one component. It is specifically designed for encapsulation and potting purposes. The product has the ability to adhere to various substrates without requiring a primer, and it cures at high temperatures.
FEATURES:
- One component product – no mixing required
- Cures at elevated temperature
- Low viscosity and semi-flowable
- Primerless adhesion to many types of substrates
- No cure by-products, low linear shrinkage
- Non-corrosive to metals and sensitive substrates
- Flame retardant: UL94HB recognized (File No. E56745)
POTENTIAL APPLICATIONS:
- Coating of hybrid IC’s, printed circuit boards, etc
- Dip coating and encapsulation of electronic devices
- General adhesive for many types of substrates
Uncured Properties | Unit | Value |
Color | White; Semi-flowable paste | |
Viscosity | Pa·s | 8.5 |
Cured Properties (cured 1 hour at 150 °C) | ||
Density | g/cm³ | 1.02 |
Hardness (Type A) | 16 | |
Elongation | % | 200 |
Tensile Strength | MPa | 0.7 |
Adhesion (Al to Al) | MPa | 0.4 |
Dielectric Strength | kV/mm | 20 |