Ultra Light-Weld 9008 engineered for chip encapsulation on flex circuits cures upon exposure to UV and/or visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. Dymax 9008 encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces such as polyimide (Kapton®), DAP, glass, epoxy board, metal, and PET. 9008 remains flexible to -40°C, making it ideal for COF applications. It is engineered for chip encapsulation on flex circuits. This product is thixotropic, allowing for easy formation of a protective encapsulant layer. It has a low dielectric constant for high frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass.
