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Ultra Light-Weld 9008

  • Product code: 9008
  • Manufacturer: Dymax
  • Package size: 10 ml syringe
  • Shelf Life:

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Ultra Light-Weld 9008 engineered for chip encapsulation on flex circuits cures upon exposure to UV and/or visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board applications. Dymax 9008 encapsulant forms flexible, highly moisture-resistant bonds to diverse surfaces such as polyimide (Kapton®), DAP, glass, epoxy board, metal, and PET. 9008 remains flexible to -40°C, making it ideal for COF applications. It is engineered for chip encapsulation on flex circuits. This product is thixotropic, allowing for easy formation of a protective encapsulant layer. It has a low dielectric constant for high frequency applications. This encapsulating material may be used in attaching FPCs to various substrates including PCB and glass.

FEATURES:

  • UV/Visible light cure
  • Flexible encapsulant
  • Moisture resistant bonds
  • Remains flexible to -40°C
  • Ideal for COF applications

APPLICATIONS:

  • Chip on board
  • Chip on flex
  • Wire bonding
Uncured properties  
Property Value Test method
Solvent content No Nonreactive solvent N/A
Chemical class Acrylated urethane N/A
Appearance transparent Lt. yellow liquid N/A
Soluble in Organic solvents N/A
Density, g/ml 1.03 ASTM D1875
Viscosity, cP (20rpm) 4,500 (nominal) ASTM D2556

 

Cured mechanical properties  
Property Value Test method
Durometer hardness D35 ASTM D2240
Tensile at break, MPa [psi] 10 [1,500] ASTM D638
Elongation at break, % 270 ASTM D638
Modulus of Elasticity, MPa [psi] 45 [6,500] ASTM D638

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