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Ultra Light-Weld 9309-SC – Light Cure BGA

  • Product code: 9309-SC
  • Manufacturer: Dymax
  • Package size: 30 ml syringe
  • Shelf Life: 7 months

   

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Light Cure BGA, CSP Reinforcement Adhesive with See-Cure Technology

Ultra Light-Weld 9309-SC adhesive cures upon exposure to UV/Visible light and is designed for rapid ruggedization of circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary, including use as an alternative to underfill. Ultra Light-Weld 9309-SC provides rapid bonding to lead frame, PCB, silicon, and ceramic. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Dymax adhesives formulated with See-Cure color-change technology appear bright blue in their uncured state, making them very visible when dispensed onto substrates. The color changes from blue to clear upon cure.

FEATURES:

  • Blue to Clear upon exposure to UV/Visible light
  • UV/Visible light cure
  • High viscosity
  • Highly thixotropic
  • Adhesion to various PCB substrates
  • Reduces stress on components

APPLICATIONS:

  • Reinforcement of Fine-Pitch or leadless components on printed circuit boards
  • Shock absorption
  • Underfill alternative

Typical Properties

Uncured properties      
Property Value Test method
Solvent content No Nonreactive solvent N/A
Chemical class Acrylated urethane N/A
Appearance Blue transparent gel N/A
Soluble in Organic solvents N/A
Density, g/ml 1.05 ASTM D1875
Viscosity, cP (20rpm) 45,000 (nominal) DSTM 502

 

Cured mechanical properties      
Property Value Test method
Durometer hardness D57 ASTM D2240
Tensile at break, MPa [psi] 22 [3,200] ASTM D638
Elongation at break, % 140 ASTM D638
Modulus of Elasticity, MPa [psi] 163 [23,800] ASTM D638

 

Other cured properties    
Property Value Test method
Appearance Clear N/A
Refractive index (20°C) 1.50 ASTM D542
Boiling water absorption, % (2h) 5.1 ASTM D570
Water absorption, % (25°C, 24h) 3.0 ASTM D570
Linear shrinkage, % 1.2 ASTM D2566

Resources

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