Light Cure BGA, CSP Reinforcement Adhesive with See-Cure Technology
Ultra Light-Weld 9309-SC adhesive cures upon exposure to UV/Visible light and is designed for rapid ruggedization of circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary, including use as an alternative to underfill. Ultra Light-Weld 9309-SC provides rapid bonding to lead frame, PCB, silicon, and ceramic. This adhesive is compatible with both needle and jet dispensing systems and is highly thixotropic, minimizing movement after dispense. Dymax adhesives formulated with See-Cure color-change technology appear bright blue in their uncured state, making them very visible when dispensed onto substrates. The color changes from blue to clear upon cure.
FEATURES:
- Blue to Clear upon exposure to UV/Visible light
- UV/Visible light cure
- High viscosity
- Highly thixotropic
- Adhesion to various PCB substrates
- Reduces stress on components
APPLICATIONS:
- Reinforcement of Fine-Pitch or leadless components on printed circuit boards
- Shock absorption
- Underfill alternative
| Uncured properties | ||
| Property | Value | Test method |
| Solvent content | No Nonreactive solvent | N/A |
| Chemical class | Acrylated urethane | N/A |
| Appearance | Blue transparent gel | N/A |
| Soluble in | Organic solvents | N/A |
| Density, g/ml | 1.05 | ASTM D1875 |
| Viscosity, cP (20rpm) | 45,000 (nominal) | DSTM 502 |
| Cured mechanical properties | ||
| Property | Value | Test method |
| Durometer hardness | D57 | ASTM D2240 |
| Tensile at break, MPa [psi] | 22 [3,200] | ASTM D638 |
| Elongation at break, % | 140 | ASTM D638 |
| Modulus of Elasticity, MPa [psi] | 163 [23,800] | ASTM D638 |
| Other cured properties | ||
| Property | Value | Test method |
| Appearance | Clear | N/A |
| Refractive index (20°C) | 1.50 | ASTM D542 |
| Boiling water absorption, % (2h) | 5.1 | ASTM D570 |
| Water absorption, % (25°C, 24h) | 3.0 | ASTM D570 |
| Linear shrinkage, % | 1.2 | ASTM D2566 |
