The camera module industry has come into focus as smartphone, tablet & vision systems in automotive manufacturers continue to develop advanced camera module technologies, capitalizing on this sector’s fast growth. Pros Technology is confident to provide our beloved customers with high-quality and reasonable price materials which would help optimize the camera manufacturing process’s performance.
Importance of underfill in Camera Module
To safeguard flip-chip image die applications, side fill underfill is the material of choice to ensure bump reinforcement during reliability testing and while in use.
The capability of the underfill is critical, with controlled flow essential to material containment and to avoiding image sensor contamination.
In addition to the flip-chip reinforcement, underfill is also used to protect the connection of the camera module to the PCB.
Key Material Properties
Controlled flow
High thixotropic index
Good bump coverage
Good fillet capability
Low-temperature cure
Long pot life
Low halogen / RoHS-compliant
Related Products
A leader in underfill material development for the semiconductor and electronics assembly markets, we have a portfolio of camera module underfills that delivers outstanding adhesion and protection with the flexibility required to accommodate stress.
