BERGQUIST GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent silicone-free solution critical to power storage applications using lithium ion batteries. This material is an exceptional choice for use in auto and consumer applications.

Technology	Silicone free
Appearance – Part A	Black
Appearance – Part B	White
Appearance (cured)	Black
Cure	Room temperature cure or Heat cure
Application	Thermal management, Gap Filler (2K)
Mix Ratio by weight: Part A: Part B	1 : 1
Mix Ratio by volume: Part A: Part B	1 : 1
Operating Temperature Range	-40 to 80ºC

KEY FEATURES

● Thermal Conductivity: 3.0 W/m-K
● Dispensable liquid, 2K Silicone free Gap Filler
● Room temperature cure – no oven required
● Extremely high dispense rate: >40 cc/sec
● Low compression stress during assembly

TYPICAL APPLICATIONS

● Automotive power storage
● Silicone sensitive applications
● Processes requiring high dispense rate
● Applications requiring high thermal transfer and low compressive stress

Typical Properties

TYPICAL UNCURED PROPERTIES BERGQUIST GAP FILLER TGF 3010APS Part A

Viscosity, mPa·s (cP):
High shear rate 3000 s^-1, ASTM D5099	5,000
Low shear rate 1.0 s^-1 , DIN 53019	425,000
Density, ASTM D792, g/cc	3.0
Storage Life @ 25°C, days	90

BERGQUIST GAP FILLER TGF 3010APS Part B

Viscosity, mPa·s (cP):
High shear rate 3000 s^-1, ASTM D5099	20,000
Low shear rate 1.0 s^-1 , DIN 53019	650,000
Density, ASTM D792, g/cc	3.0
Storage Life @ 25°C, days	90

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties
Hardness, Shore 00, 6.35 mm thick sample	75
Heat Capacity, ASTM D1269, J/g-K	0.87
Flammability, UL 94	V-0
Siloxane Content, ΣD4-D10 , ASTM F2466, ppm	ND

Electrical Properties
Dielectric Strength, ASTM D149, V/mm	14,000
Dielectric Constant , ASTM D150 @ 1000 Hz	17
Volume Resistivity, ASTM D257, ohm-meter	1×10^6
Thermal Properties
Thermal Conductivity, ASTM D5470, W/(m-K)	3.0

Resources

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