BERGQUIST® TGR 1500A is a high performance, thermally conductive compound intended for use as a thermal interface material between a high-end computer processor and a heat sink. Other high watt density applications will also benefit from the extremely low thermal impedance of BERGQUIST® TGR 1500A.
BERGQUIST® TGR 1500A compound wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The compound requires pressure of the assembly to cause flow.
BERGQUIST® TGR 1500A compound will resist dripping. For microprocessor applications, traditional screw fastening or spring clamping methods will provide adequate force to optimize the thermal performance of BERGQUIST® TGR 1500A. An optimized application would utilize the minimum volume of BERGQUIST® TGR 1500A material necessary to ensure complete wet-out of both mechanical interfaces.
FEATURES:
• High thermal performance:
0.32°C/W (at 50 psi)
• Good screenability
• Room temperature storage
• No post “cure” required
• Exceptional value
