JONES Thermal Gel 21-340-SP01
JONES 21-340-SP01 is a compliant, soft thermal gap filler with 3.5 W/m·K conductivity. It is designed to fill variable gaps while applying minimal stress to components, offering excellent reworkability and dispensing control.
21-340-SP01 Features
- Thermal conductivity: 3.5 W/m·K
- Pre-cured, no cure required
- Soft and compliant formulation
- Low thermal resistance and electrical isolation
21-340-SP01 Applications
- Thermal transfer to chassis or frames
- Flat panels, memory modules
- Automotive and telecom equipment
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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|
Properties |
Thermal Gel 21-340-SP01 |
Test Method |
|
|
Thermal |
Thermal Conductivity (W/m·K) |
3.5 |
ASTM D5470 |
|
Thermal Resistance (°C.cm^2/W) @1mm |
- |
ASTM D5470 |
|
|
Operating Temperature Range (°C) |
-55~150 |
JONES Test Method |
|
|
Physical |
Color |
Green |
Visual |
|
Composition |
Ceramic & Silicone |
- |
|
|
Density (g/cc) |
3.2 |
ASTM D792 |
|
|
Flow Rate (g/min) |
48 |
90 Psi,EFD 180cc @ Ø3.17mm nozzle |
|
|
Typical Minimum Bondline Thickness (mm) |
0.10 |
JONES Test Method |
|
|
Electrical |
Breakdown Voltage (KV AC /mm) |
> 5 |
ASTM D149 |
|
Volume Resistivity (Ohm·cm) |
10^13 |
ASTM D257 |
|
|
Dielectric Constant @1MHz |
5.0 |
ASTM D150 |
|
|
Regulatory |
Flammability Rating |
V0 |
UL 94 |
