JONES 21-340-SP01 is a compliant, soft thermal gap filler with 3.5 W/m·K conductivity. It is designed to fill variable gaps while applying minimal stress to components, offering excellent reworkability and dispensing control.
21-340-SP01 Features
Thermal conductivity: 3.5 W/m·K
Pre-cured, no cure required
Soft and compliant formulation
Low thermal resistance and electrical isolation
21-340-SP01 Applications
Thermal transfer to chassis or frames
Flat panels, memory modules
Automotive and telecom equipment
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
