LiPOLY EP770 Two-Part Thermal Gap Filler
EP770 is a silicone-free epoxy-based sealing gap filler with 2.5 W/m*K thermal conductivity. It offers low shrinkage, high hardness, and vibration damping, ideal for high-tolerance heat dissipation needs.
EP770 Features
- Thermal conductivity: 2.5 W/m*K
- Low mixing viscosity and shrinkage (0.01%)
- Excellent flow and adhesion
EP770 Applications
- Motors, IGBT modules, CPUs, wireless hubs
- EV components and 5G infrastructure
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
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|
PROPERTY |
EP770 |
TEST METHOD |
UNIT |
|
Color |
Black |
Visual |
- |
|
Resin base |
Epoxy |
- |
- |
|
A:B |
100:10 |
- |
- |
|
Viscosity A |
350 |
ISO 3219 |
Pa.s |
|
Viscosity mixed |
5 |
ISO 3219 |
Pa.s |
|
Shrinkage rate |
0.01 |
ASTM D2566 |
% |
|
Density |
1.8 |
ASTM D792 |
g/cm³ |
|
Application temperature |
-60~150 |
- |
°C |
|
Curing condition 1 |
80°C/1.5 hrs |
By LiPOLY |
- |
|
Curing condition 2 |
25°C/35 hrs |
By LiPOLY |
- |
|
Hardness |
80 |
ASTM D2240 |
Shore A |
|
Tensile strength |
73 |
ISO527 |
N/cm² |
|
Lap shear to aluminum |
412 |
ASTM D1002 |
N/cm² |
|
Shelf life |
24 months |
- |
- |
|
ROHS & REACH |
Compliant |
- |
- |
|
ELECTRICAL |
|||
|
Dielectric breakdown |
14 |
ASTM D149 |
KV/mm |
|
Volume resistivity |
>10¹¹ |
ASTM D257 |
Ohm-m |
|
THERMAL |
|||
|
Thermal conductivity |
2.5 |
ASTM D5470 |
W/m*K |
