EP770 is a silicone-free epoxy-based sealing gap filler with 2.5 W/m*K thermal conductivity. It offers low shrinkage, high hardness, and vibration damping, ideal for high-tolerance heat dissipation needs.
EP770 Features
Thermal conductivity: 2.5 W/m*K
Low mixing viscosity and shrinkage (0.01%)
Excellent flow and adhesion
EP770 Applications
Motors, IGBT modules, CPUs, wireless hubs
EV components and 5G infrastructure
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
