LiPOLY H-putty is a one-part thermal putty with 3.5 W/m*K conductivity. It fills small gaps with ease and resists drying or overflow, making it a dependable thermal interface material for delicate electronics and automated production lines.
H-putty Features
Thermal conductivity: 3.5 W/m*K
Bond line thickness: 100–3000µm
Compensates for surface irregularities
Stress-free for sensitive parts
Non-slumping, non-flowing
H-putty Applications
CPU and component gap filler
Telecom infrastructure and IP CAMs
Displays and set-top boxes
5G systems and electric vehicles
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?
