LiPOLY T-top81-s High Thermal Conductive Gap Filler
LiPOLY T-top81-s is a thermal interface material with 8.0 W/m*K conductivity. It excels in filling air gaps with minimal thermal resistance, making it suitable for densely packed and high-speed electronics.
T-top81-s Features
- Thermal conductivity: 8.0 W/m*K
- High compressibility
- Extremely low thermal impedance
T-top81-s Applications
- CPUs, heat sinks, and displays
- Power supply units
- 5G base stations and electric vehicles
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
Typical Properties
|
PROPERTY |
T-top81-s |
TEST METHOD |
UNIT |
|
Color |
Purple |
Visual |
– |
|
Surface tack 2-side/1-side |
2 |
– |
– |
|
Thickness |
Customized |
ASTM D374 |
mm |
|
Density |
3.4 |
ASTM D792 |
g/cm³ |
|
Hardness |
35 |
ASTM D2240 |
Shore OO |
|
TML |
<0.1 |
By LiPOLY |
% |
|
Application temperature |
-60~150 |
– |
°C |
|
ROHS & REACH |
Compliant |
– |
– |
|
COMPRESSION |
|||
|
Deflection @10 psi |
7 |
ASTM D5470 modify |
% |
|
Deflection @20 psi |
20 |
ASTM D5470 modify |
% |
|
Deflection @30 psi |
43 |
ASTM D5470 modify |
% |
|
Deflection @40 psi |
64 |
ASTM D5470 modify |
% |
|
Deflection @50 psi |
68 |
ASTM D5470 modify |
% |
|
ELECTRICAL |
|||
|
Dielectric breakdown |
8 |
ASTM D149 |
KV/mm |
|
Surface resistivity |
>10¹¹ |
ASTM D257 |
Ohm |
|
Volume resistivity |
>10¹⁰ |
ASTM D257 |
Ohm-m |
|
Dielectric constant@10MHz Dk |
10.2 |
ASTM D150 |
– |
|
Dielectric constant@1GHz Dk |
10.1 |
ASTM D150 |
– |
|
Dielectric constant@1.8GHz Dk |
10.8 |
ASTM D150 |
– |
|
Dielectric factor@10MHz Df |
0.006 |
ASTM D150 |
– |
|
Dielectric factor@1GHz Df |
0.002 |
ASTM D150 |
– |
|
Dielectric factor@1.8GHz Df |
0.021 |
ASTM D150 |
– |
|
THERMAL |
|||
|
Thermal conductivity |
8.0 |
ASTM D5470 |
W/m*K |
|
Thermal Conductivity |
5.5 |
ISO 22007-2 |
W/m*K |
|
Thermal impedance@10psi |
0.260 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@20psi |
0.221 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@30psi |
0.148 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@40psi |
0.122 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@50psi |
0.112 |
ASTM D5470 |
°C-in²/ W |
|
Coefficient of thermal expansion |
-236.67×10ˉ⁶ |
ASTM E228 |
1/K |
