Multi-Cure 9-20801 cures upon exposure to UV light, heat and/or activator and is designed for rapid mounting of heat-sensitive components on printed circuit boards to provide highly conductive bonds to heat-dissipation elements such as heat sinks. Multi-Cure 9-20801 thermal interface material is a Multi-Cure material specially formulated to cure with heat or activator between opaque substrates. Most high-speed processes call for dispensing Multi-Cure 9-20801 on the substrate surface and then applying a thin layer of Dymax 501-E-REV-A activator to the opposite component surface. The parts are mated and then exposed to light. This exposure cures the edges of the component in seconds so the parts are fixtured allowing for immediate handling and movement to the next step in the process. Material between opaque surfaces will cure over time, typically minutes or hours. Light cure allows for exposed areas to cure in seconds, fixturing parts in place so a secondary cure can effectively cure shadowed areas without interruption to process flow.

FEATURES:

• UV light cure
• Secondary activator or heat cure
• Highly Conductive
• Thixotropic for easy dispense and placement prior to cure
• Superior adhesion to FR4 and many metals
• Fast UV cure for immediate fixture strength

APPLICATIONS:

• Mounting heat sinks
• Bonding heat sensitive components to PCBs