LiPOLY PK223DM Thermal Conductive Gap Filler
LiPOLY PK223DM is a two-part, fast-curing thermal gap filler featuring 2.2 W/m*K thermal conductivity. It provides efficient heat dissipation and is designed for easy application with robots or syringes, ensuring performance across diverse electronics environments.
PK223DM Features
- Thermal conductivity: 2.2 W/m*K
- Fast room-temperature or heat-assisted curing
- Excellent sealing performance under low pressure
- Reliable for long-term use
PK223DM Applications
- CPU and heatsink gap filling
- Power supply components
- Mass storage and telecom hardware
- Automotive and EV battery systems
- 5G infrastructure devices
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
PROPERTY
| Property | PK223DM | Test Method | Unit |
|---|---|---|---|
| Color | White (A part), Gray (B part) | Visual | - |
| Solid content | 100% (Two-part: 100:100) | - | - |
| Viscosity A | 120 | ISO 3219 | Pa.s |
| Viscosity B | 110 | ISO 3219 | Pa.s |
| Density | 2.2 | ASTM D792 | g/cm³ |
| Shelf life | 24 months | - | - |
| ROHS & REACH | Compliant | - | - |
SOLID (AFTER CURE)
| Property | PK223DM | Test Method | Unit |
|---|---|---|---|
| Thermal conductivity | 2.2 | ASTM D5470 | W/m*K |
| Thermal impedance @ 10 mils BLT | 0.294 | ASTM D5470 | °C-in²/W |
| Thermal impedance @ 20 mils BLT | 0.571 | ASTM D5470 | °C-in²/W |
| Thermal impedance @ 30 mils BLT | 0.710 | ASTM D5470 | °C-in²/W |
| Hardness | 50 | ASTM D2240 | Shore OO |
| Working temp (long term) | -60 ~ 200 | - | °C |
| Operating ambient temp | 20 ~ 30 | - | °C |
CURE SCHEDULE
| Property | PK223DM | Test Method | Unit |
|---|---|---|---|
| Pot life @ 25°C | 10~15 | By LiPOLY | minutes |
| Surface dry @ 25°C | 20~25 | By LiPOLY | minutes |
| Cure @ 25°C | 30~35 | By LiPOLY | minutes |
| Cure @ 100°C | 72 | By LiPOLY | seconds |
| Cure @ 120°C | 20 | By LiPOLY | seconds |
