LiPOLY PK404DM Thermal Conductive Gap Filler
LiPOLY PK404DM is a two-part thermal gap filler with a thermal conductivity of 3.6 W/m*K. It cures quickly at room temperature and offers consistent thermal performance, making it ideal for automated dispensing in electronic systems requiring efficient heat management.
PK404DM Features
- Thermal conductivity: 3.6 W/m*K
- Quick curing at room or elevated temperature
- High reliability for electronic assemblies
- Maintains performance under low pressure
PK404DM Applications
- CPU and heatsink interfaces
- Power supply thermal management
- Mass storage devices
- Telecom systems
- EV and automotive batteries
- 5G base station hardware
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
|
PROPERTY |
PK404DM |
TEST METHOD |
UNIT |
|
Color |
Blue (A part) White (B part) |
Visual |
- |
|
Solid content |
100% (Two-part : 100:100) |
- |
- |
|
Viscosity A |
47 |
ISO 3219 |
Pa.s |
|
Viscosity B |
48 |
ISO 3219 |
Pa.s |
|
Density |
3.0 |
ASTM D792 |
g/cm³ |
|
Shelf life |
24 months |
- |
- |
|
ROHS & REACH |
Compliant |
- |
- |
|
SOLID(AFTER CURE) |
|||
|
Thermal conductivity |
3.6 |
ASTM D5470 |
W/m*K |
|
Thermal impedance@10mils BLT |
0.252 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@20mils BLT |
0.471 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@30mils BLT |
0.730 |
ASTM D5470 |
°C-in²/ W |
|
Hardness |
80 |
ASTM D2240 |
Shore OO |
|
Working temp (long term) |
-60 ~ 200 |
- |
°C |
|
Operating ambient temp |
20 ~ 30 |
- |
°C |
|
ELECTRICAL |
|||
|
Dielectric breakdown |
8 |
ASTM D149 |
KV/mm |
|
Surface resistivity |
>10¹⁰ |
ASTM D257 |
Ohm |
|
Volume resistivity |
>10¹⁰ |
ASTM D257 |
Ohm-m |
|
CURE SCHEDULE |
|||
|
Pot life @ 25°C |
10~15 |
By LiPOLY |
min |
|
Surface dry @ 25°C |
20~25 |
By LiPOLY |
min |
|
Cure @ 25°C |
25~30 |
By LiPOLY |
min |
|
Cure @ 100°C |
60 |
By LiPOLY |
sec |
|
Cure @ 120°C |
20 |
By LiPOLY |
sec |
