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Home > Products > By Manufacturer > Shiu Li Lipoly > LiPOLY PK605DM Two-Part Thermal Conductive Gap Filler
LiPOLY PK605DM Two-Part Thermal Conductive Gap Filler PK605DM Prostech Philippines

LiPOLY PK605DM Two-Part Thermal Conductive Gap Filler

  • Product code: PK605DM
  • Manufacturer: Shiu Li Lipoly
  • Package size: 160 gram syringe
  • Shelf Life: 2 years

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  • Description
  • Specification
  • TDS/MSDS
  • Related Article
  • LiPOLY PK605DM Thermal Conductive Gap Filler
  • PK605DM Features
  • PK605DM Applications
  • About Prostech

LiPOLY PK605DM Thermal Conductive Gap Filler

LiPOLY PK605DM is a two-part, high-performance thermal gap filler that cures quickly at room or elevated temperatures. With a thermal conductivity of 5.0 W/m*K, it provides excellent thermal transfer and low impedance, making it ideal for robotic or syringe-based dispensing in electronic assemblies.

PK605DM Features

  • Thermal conductivity: 5.0 W/m*K
  • Fast curing at room temperature or elevated temperature
  • High reliability for long-term performance
  • Effective sealing under low pressure

PK605DM Applications

  • CPU to heatsink interfaces
  • Component-to-heatsink gaps
  • Power supply systems
  • High-speed storage devices
  • Telecommunication hardware
  • EV & automotive battery modules
  • 5G base station infrastructure

About Prostech

Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:

  • PCB Assembly Materials
  • Cleaning & Degreaser
  • Circuit Board Protection
  • Thermal Management Solutions
  • EMI Shielding
  • General Assembly Adhesives
  • Elastomeric Materials
  • Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines

Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.

International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?

Contact Prostech Philippines today

PROPERTY PK605DM TEST METHOD UNIT
Color Red (Part A) Visual -
  White (Part B) Visual -
Solid Content 100% (Two-part: 100:100) -
Viscosity A 110 ISO 3219 Pa.s
Viscosity B 80 ISO 3219 Pa.s
Density 3.3 ASTM D792 g/cm³
Shelf Life 24 months - -
ROHS & REACH Compliant Yes - -
SOLID (AFTER CURE)      
Thermal Conductivity 5.0 ASTM D5470 W/m*K
Thermal Impedance @ 10 mils BLT 0.092 ASTM D5470 °C-in²/W
Thermal Impedance @ 20 mils BLT 0.171 ASTM D5470 °C-in²/W
Thermal Impedance @ 30 mils BLT 0.254 ASTM D5470 °C-in²/W
Hardness 85 ASTM D2240 Shore OO
Working Temperature (long term) -60 ~ 200 - °C
Operating Ambient Temperature 20 ~ 30 - °C
CURE SCHEDULE      
Pot Life @ 25°C      
Surface Dry @ 25°C 20~25 By LiPOLY minutes
Cure @ 25°C 25~30 By LiPOLY minutes
Cure @ 100°C 40 By LiPOLY seconds
Cure @ 120°C 10 By LiPOLY seconds
ELECTRICAL      
Dielectric Breakdown 8 ASTM D149 KV/mm
Surface Resistivity >10¹¹ ASTM D257 Ohm
Volume Resistivity >10¹⁰ ASTM D257 Ohm-m

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    LiPOLY PK605DM Two-Part Thermal Conductive Gap Filler

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      LiPOLY PK605DM Two-Part Thermal Conductive Gap Filler

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        LiPOLY PK605DM Two-Part Thermal Conductive Gap Filler

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          LiPOLY PK605DM Two-Part Thermal Conductive Gap Filler

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