LiPOLY PK605DM is a two-part, high-performance thermal gap filler that cures quickly at room or elevated temperatures. With a thermal conductivity of 5.0 W/m*K, it provides excellent thermal transfer and low impedance, making it ideal for robotic or syringe-based dispensing in electronic assemblies.
PK605DM Features
Thermal conductivity: 5.0 W/m*K
Fast curing at room temperature or elevated temperature
High reliability for long-term performance
Effective sealing under low pressure
PK605DM Applications
CPU to heatsink interfaces
Component-to-heatsink gaps
Power supply systems
High-speed storage devices
Telecommunication hardware
EV & automotive battery modules
5G base station infrastructure
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
Technical Added Value to customer Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers. Need help selecting the right product or solution?