LiPOLY® PK700DM Thermal Gap Filler
PK700DM is a two-part liquid thermal gap filler with 7.0 W/m*K conductivity. It offers fast curing at room temperature and excellent sealing under low pressure, suitable for high-performance electronics.
PK700DM Features
- Thermal conductivity: 7.0 W/m*K
- Fast curing at ambient or elevated temperature
- Low pressure sealing and high reliability
PK700DM Applications
- CPUs, components, and heat sinks
- Automotive batteries and EV systems
- 5G base station cooling
About Prostech
Prostech Philippines is a one-stop solution provider for specialty materials and equipment across electronics manufacturing, from PCBA to final assembly. Our core material and equipment solutions include:
- PCB Assembly Materials
- Cleaning & Degreaser
- Circuit Board Protection
- Thermal Management Solutions
- EMI Shielding
- General Assembly Adhesives
- Elastomeric Materials
- Process Equipment: Potting & Coating Systems, UV/ Heat Curing, Plasma Treatment, Tape placement automation, and cleaning machines
Technical Added Value to customer
Prostech offers customized material and process equipment solutions with engineering support throughout R&D, production process optimization, and performance validation. Our in-house lab located in Alabang, Muntinlupa is equipped to conduct electronics material testing, application simulation, and adhesive validation, helping customers reduce the need for onsite trials and accelerate implementation.
International Supply Chain Advantage
Regional warehouse hubs across Vietnam, Singapore, Malaysia, and the Philippines ensure cross-border reliable supply. In Philippines PEZA-bonded warehouse located at Lima Industrial Park, Batangas enables Prostech to provide responsive, demand-based delivery and significantly shortens standard lead time for Philippines customers.
Need help selecting the right product or solution?
Typical Properties
|
PROPERTY |
PK700DM |
TEST METHOD |
UNIT |
|
Color |
Gray (A part) White (B part) |
Visual |
– |
|
Solid content |
100% (Two-part : 100:100) |
– |
– |
|
Viscosity A |
315 |
ISO 3219 |
Pa.s |
|
Viscosity B |
285 |
ISO 3219 |
Pa.s |
|
Density |
2.8 |
ASTM D792 |
g/cm³ |
|
Shelf life |
24 months |
– |
– |
|
ROHS & REACH |
Compliant |
– |
– |
|
SOLID(AFTER CURE) |
|||
|
Thermal conductivity |
7.0 |
ASTM D5470 |
W/m*K |
|
Thermal impedance@10mils BLT |
0.058 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@20mils BLT |
0.115 |
ASTM D5470 |
°C-in²/ W |
|
Thermal impedance@30mils BLT |
0.170 |
ASTM D5470 |
°C-in²/ W |
|
Hardness |
60 |
ASTM D2240 |
Shore OO |
|
Working temp (long term) |
-60 ~ 200 |
– |
°C |
|
Operating ambient temp |
20 ~ 30 |
– |
°C |
|
ELECTRICAL |
|||
|
Dielectric breakdown |
8 |
ASTM D149 |
KV/mm |
|
Surface resistivity |
>10¹¹ |
ASTM D257 |
Ohm |
|
Volume resistivity |
>10¹⁰ |
ASTM D257 |
Ohm-m |
|
CURE SCHEDULE |
|||
|
Pot life @ 25°C |
20~30 |
By LiPOLY |
min |
|
Surface dry @ 25°C |
30~40 |
By LiPOLY |
min |
|
Cure @ 25°C |
40~50 |
By LiPOLY |
min |
|
Cure @ 100°C |
40 |
By LiPOLY |
sec |
|
Cure @ 120°C |
10 |
By LiPOLY |
sec |
