In recent years, the risk of overheating, which can lead to reduced performance or even fire and explosion of electronic

NSP-35 is a one-part, fully cured non-silicone gap filler with has been designed to reduce the time to market and overall

PC98 is a white, highly filled non-silicone system used for thermal dissipation of electronic devices. It has a long shelf

Thermal adhesive or called thermal conductive (heat-conducting) adhesive/ glue is the combination of strong bonding with robust thermal performance in

Silicone-Free Heat Sink Compound draws heat away when applied to a component. Also known as thermal grease, thermal paste thermal compound,

  Why thermal management in PCBs?  1. Higher density of components in PCBs surface   The electronic industry field is

Definition of Thermal Pad Thermal Pad (also called thermally conductive pad or thermal interface pad) are a preformed square or

3M™ Thermally Conductive Acrylic Interface Pad 5590H is a soft acrylic based pad designed to provide a preferential heat transfer path

TGZNSG is a dry to touch thermal interface pad formulated with non-silicone thermal grease. It was developed to offer the

TG-NSP36K-1 is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic

TG-NSP36K is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic

PC96 is a soft, non-silicone thermal interface pad. PC96 is designed to replace silicone pads when the application could not