NSP-35 is a one-part, fully cured non-silicone gap filler with has been designed to reduce the time to market and overall

PC98 is a white, highly filled non-silicone system used for thermal dissipation of electronic devices. It has a long shelf

Silicone-Free Heat Sink Compound draws heat away when applied to a component. Also known as thermal grease, thermal paste thermal compound,

3M™ Thermally Conductive Acrylic Interface Pad 5590H is a soft acrylic based pad designed to provide a preferential heat transfer path

TGZNSG is a dry to touch thermal interface pad formulated with non-silicone thermal grease. It was developed to offer the

TG-NSP36K-1 is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic

TG-NSP36K is a non-silicone based thermally conductive putty, suitable for use as a thermal interface material for cooling of electronic

PC96 is a soft, non-silicone thermal interface pad. PC96 is designed to replace silicone pads when the application could not

BERGQUIST GAP FILLER TGF 3010APS is a non-silicone, 2-part room temperature curable gap filler suitable for use in high throughput