Momentive siliicone foam RTF7000
https://prostech.ph/momentive-siliicone-foam-rtf7000/

The RTF7000 variable density foam system is a multi-component product which allows end-users to design finished foam products with a

Battery Module Solution for Electric Vehicle
https://prostech.ph/battery-module-solution-for-electric-vehicle/

When it comes to battery modules, two other words often come to mind: battery cell, battery pack. In fact, battery

Liquid Dispense Gap Fillers Silcool TIA225GF
https://prostech.ph/liquid-dispense-gap-fillers-silcool-tia225gf/

TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create

Cooling System in Battery Pack Solution
https://prostech.ph/cooling-system-for-battery-pack-solution/

Due to inefficiency, battery cells will not only generate electricity but also heat. This heat should be moved from the

Sealing Battery Pack between Upper Case and Lower Case
https://prostech.ph/sealing-battery-pack/

Why Battery Pack Sealing? Achieving a quality seal is critical for the performance and longevity of EV batteries and for

Materials for Underfill and Encapsulation for PCB assembly
https://prostech.ph/materials-for-underfill-and-encapsulation-for-pcb-assembly/

Underfill Underfills can be used to help reinforce electronic components and minimize stress. They also offer excellent protection of solder

Circuit Board – Total Solution
https://prostech.ph/circuit-board-total-solution/

Are you looking for a professional and one-stop solution provider for your Circuit Board Produce Line?  1. Module Sealant Printed

Electrically Conductive Adhesive
https://prostech.ph/electrically-conductive-adhesive/

  What is Electrically Conductive Adhesive? Electrically Conductive Adhesive is used for high-reliability applications such as electronics, automotive, medical, and

BERGQUIST® GAP PAD® TGP 3004SF
https://prostech.ph/bergquist-gap-pad-tgp-3004sf/

BERGQUIST® GAP PAD® TGP 3004SF is a high-performance, 3.0 W/m-K, thermally conductive gap filling material. BERGQUIST® GAP PAD® TGP 3004SF

BERGQUIST® GAP PAD® TGP 2000SF
https://prostech.ph/bergquist-gap-pad-tgp-2000sf/

BERGQUIST® GAP PAD® TGP 2000SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material

BERGQUIST® GAP PAD® TGP 800VOS
https://prostech.ph/bergquist-gap-pad-tgp-800vos/

BERGQUIST GAP PAD TGP 800VOS is recommended for applications that require a minimum amount of pressure on components. BERGQUIST GAP

Momentive SilCool* TIG2000
https://prostech.ph/momentive-silcool-tig2000/

TIG2000 is a silicone grease compound featuring good thermal conductivity, dielectric properties, good workability, limited oil separation, and minimal weight