XE14-TM009 is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its non-slumping

SilCool TIA265GF (XE14-D0034) is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices.

SilCool TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its

TIA268GF (XE14-C7413) is a 2-component, soft, thermally conductive silicone material that is designed to dissipate heat from electronic devices. Its

XE13-C1862PT is a one-component, heat curable silicone adhesive designed for thermally conductive applications. The product cures quickly with heat and

TSE3281-G silicone adhesive is a one component, medium viscosity, thermally conductive material, which cures to an elastomer when heat is

TIG830SP is a silicone grease that provides high thermal conductivity and low thermal resistance. The worability of TIG830SP makes it

TIG210BX is a silicone compound that provides high thermal conductivity. It exhibits virtually no oil separation and minimal weight loss

TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create

TG-PP-10 is a high-performance silicone putty material which is designed to offer a low cost of ownership approach to thermal

TG4040SA is an ultra-soft, silicone based thermal gap filler which offers low thermal impedance, good surface compliance and a high dielectric

NSP-35 is a one-part, fully cured non-silicone gap filler with has been designed to reduce the time to market and overall